High speed grinding of silicon nitride with resin bond ...
2003-11-1 · Resin bond diamond wheels of grit sizes of about 160 and 20. μm were used.. The wheels have a diameter of 200 mm and a width of 6 mm.Before grinding, the wheels were balanced at 40 m/s using a dynamic balancing instrument (Sigma SB-7001).After balancing, the wheels were trued using a vitrified silicon carbide wheel (GC80M7V) with a diameter of 75 mm.
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